The Union Cabinet approved a new semiconductor plant in Uttar Pradesh's Jewar to be jointly set up by HCL Technologies and Foxconn. The newly approved facility will come up at an investment of Rs 3,700 crore.This is the sixth unit approved under the India Semiconductor Mission, with five semiconductor facilities in advanced stages of construction. Three of these units—by Micron Technologies, Kaynes Technologies and a combination of CG Power-Renesas Electronics and Star Microelectronics—are based in Sanand, Gujarat. The Tata Group is building one semiconductor facility in Dholera, Gujarat and another in Assam.As semiconductor manufacturing shapes up in India, here's a look at the six facilities being built in the country.HCL-Foxconn fab in JewarThe HCL-Foxconn semiconductor plant will be set up near the upcoming Jewar airport in Yamuna Expressway Industrial Development Authority (YEIDA). It will manufacture display driver chips for mobile phones, laptops, automobiles, PCs, and other devices.The plant will have a monthly output of 20,000 wafers. The facility can churn out 36 million units per month, a government statement said.Production is expected to begin in 2027.Micron fab in SanandThe Union Cabinet approved Micron Technology's semiconductor plant in Sanand in June 2023.The first chip is expected to roll out this year, although there have been some delays with the first phase. Micron is already looking for partners to build the second phase of the plant.Most of the memory and storage products manufactured at this assembly will be export-led.The facility had a proposed investment of $2.75 billion, of which $825 million was committed by Micron. The rest will be covered by central and state government subsidies.Tata Electronics-PSMCTata Electronics and Taiwan's Powerchip Semiconductor Manufacturing Corp will make high-performance 28nm compute chips at their facility in Dholera, Gujarat. It will also make power management chips for electric vehicles, telecom, defence, automotive, consumer electronics, display, and power electronics.The plant was approved in February last year, with an investment of Rs 91,500 crore.The Tata-PSMC facility can produce 50,000 wafers a month.Tata chip facility in AssamIn February 2024, Tata Semiconductor Assembly and Test got approval for setting up an assembly, testing, marking and packaging (ATMP) unit in Morigaon, Assam, with an investment of Rs 27,000 crore.The facility will use indigenous semiconductor packaging technologies with a daily output capacity of 48 million chips.Chips produced here will find applications in automotive, electric vehicles, consumer electronics, telecom, and mobile phones, with Tesla one of its likely clients.CG Power, Renesas Electronics, Stars Microelectronic unit in SanandCG Power and Industrial Solutions, in collaboration with Japan's Renesas Electronics Corporation and Thailand's Stars Microelectronic are setting up an ATMP unit in Sanand, Gujarat, at an investment of Rs 7,600 crore.The production capacity would be over 15 million units per day, with chips going to consumer, industrial, automotive and power applications.Also Read: Renesas-CG Power venture likely to roll out first chip by mid-2026, says Hidetoshi ShibataKaynes TechKaynes Technology India’s proposal for setting up an outsourced semiconductor assembly and test (OSAT) facility at Sanand, Gujarat, was approved in September 2024. The facility is being built with an investment of Rs 3,300 crore.Malaysian ISO Technology and Taiwan's Aptos Technology will provide imported wafers to Kaynes, which will handle assembly, testing and packaging for them.The OSAT unit will have a production capacity of 6.33 million chips per day, and around 200 million chips a year. The company aims to scale it to one billion chips per annum in five years.