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HCL-Foxconn OSAT facility will help meet growing demand for advanced technologies: Roshni Nadar Malhotra
@Source: indiatimes.com
The HCL-Foxconn JV combines HCL’s deep-rooted engineering DNA and depth in technology with Foxconn’s semiconductor capabilities, chairperson of the HCL Group Roshni Nadar Malhotra, said on Thursday. Nadar-Malhotra's statement comes a day after the consortium received the Cabinet nod for a Rs 3,706 crore outsourced semiconductor assembly and test (OSAT) facility in Uttar Pradesh (UP). This collaboration will support key sectors such as consumer electronics, automotive, and industrial systems, she said in a statement. The facility, with a capacity of 20,000 wafers per month, will help meet the growing demand for advanced technologies. It is expected to generate over 3,500 jobs. We are also focused on building semiconductor skills and enabling India’s workforce in this field. HCL Group and Hon Hai Technology Group (Foxconn) received the Cabinet’s approval on Wednesday to set up an OSAT facility in the Yamuna Expressway Industrial Development Authority (YEIDA) region near Jewar airport. This marks the sixth semiconductor unit to be sanctioned under the India Semiconductor Mission and the first such unit to be set up in UP.Foxconn, on its part, called it a 'landmark decision' that represented a strong vote of confidence in Foxconn’s long-term commitment to India’s semiconductor and electronics manufacturing ecosystem. This OSAT venture reflects our strong belief in local partnerships, innovation, and India’s potential to emerge as a major hub for advanced semiconductor packaging and testing, Foxconn said. As we enter the execution phase, Foxconn remains focused on building local capabilities, nurturing talent, and delivering world-class manufacturing outcomes in India. This is Foxconn's second attempt at setting up a semiconductor unit in India. The first time around, the Taiwanese contract manufacturing giant had applied with Vedanta as their partner.The upcoming plant will manufacture display driver chips used in mobile phones, laptops, automobiles, PCs, and other devices with displays. This unit is the first-of-its-kind and is expected to contribute significantly to meeting domestic demand for such chips. Union minister for electronics and information technology Ashwini Vaishnaw on Wednesday had said that this plant will contribute to about 40% of India's total demand for display driver chips.
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